Description:
(HV & gt; 125), high strength (tensile strength & gt; 350 MPa), and corresponding data of oxygen-free copper HV40,250 MPa relative to oxygen-free copper material. And has a high softening temperature.

Product features:

grade	Melting point	softening temperature	Density g / cm 3	Thermal expansion coefficient (10 -6 / K)	Thermal conductivity W / M.K
C15715	1083 ° C	800 ° C	8.84	365	17.6
C1560	1083 ° C	910 ℃	8.81	322	17.6

Comparison of various types of diffused copper with oxygen-free copper composition and physical properties (at room temperature unless otherwise noted)
UNS alloy quantity	Alumina content	Melting point	Density g / cm 3 lb / in 3	Conductivity	Thermal conductivity (W / M.K)	Thermal expansion coefficient (range 20-150 ° C, 68-300 ° F)	Elastic modulus
OFC	0%	1083 ° C (1981 ° F)	8.94 (0.323)	58 Meg S / m (101% IACS)	391 wat / m / OK (226 BTU / ft / hr / OF)	17.7 um / m / ° C (9.8 u-in / in / OF)	115GPa (17 Mpsi)
UNS-C15715	0.3wt.%	1083 ° C (1981 ° F)	8.90 (0.321)	54 Meg S / m (92% IACS)	365 wat / m / OK (221 BTU / ft / hr / OF)	16.6 um / m / ° C (9.2 u-in / in / OF)	130GPa (19 Mpsi)
UNS-C15760	1.1wt.%	1083 ° C (1981 ° F)	8.81 (0.318)	45 Meg S / m (78% IACS)	322 wat / m / OK (186 BTU / ft / hr / OF)	16.6 um / m / ° C (9.2 u-in / in / OF)	130GPa (19 Mpsi)

- If you need to reduce the thermal expansion rate can be added to other materials or elements, in the high room temperature and high strength heating when added, the hardness will be enhanced.
- Adding Glid-60 and 10% niobium to the composites improves the strength and conductivity of the material. Its hardness is equivalent to most copper-tungsten alloys, and the resistance to conductivity is comparable to that of all RWMA2 grades.