For high strength medium heat conduction, good cold processing, electroplating, hot dip tin properties, suitable for soldering and gas shielded welding
Product categories:Copper and nickel silicon tape
Product brand:
Characteristic:
For high strength medium heat conduction, good cold processing, electroplating, hot dip tin properties, suitable for soldering and gas shielded welding.Product specific parameters
ASTM/CDA | DIN/EN | JIS | CHARCTERISTICS | APPLICATION |
C70250 | CuNi3SiMg | C7025 | For high strength medium heat conduction, good cold processing, electroplating, hot dip tin properties, suitable for soldering and gas shielded welding. | Mainly used in high-end areas such as integrated circuits, such as electrical parts, stamping parts, connectors, relay springs, semiconductor parts. |