Description:
- tungsten copper electronic packaging material not only has the low expansion characteristics of tungsten, but also has the characteristics of high thermal conductivity of copper, especially valuable, its thermal expansion coefficient and thermal conductivity can be adjusted by adjusting the composition of the material to be designed, so the application of materials Tungsten copper alloy with adjustable thermal expansion coefficient, and stainless steel, can valve alloy, silicon, gallium arsenide, gallium nitride, alumina (black, white) can be a good match.
- Our company's tungsten copper alloy performance is at the leading domestic level. As a typical P / M material, our products have very low porosity, and the BET surface is half of the domestic counterparts (5 * 5 * 52mm samples are used ). In this way, the product has a good air tightness, helium mass spectrometer leak test "5 * 10-9Pa & middot; m3 / S can be fully passed.
- The company tungsten copper alloy products do not add any activated sintered elements such as iron, nickel, cobalt, manganese. Has good thermal conductivity and thermal expansion matching performance. Tungsten copper alloy for electronic packaging (heat sink) can be customized according to customer requirements: WxCuy, x + y = 100
Product features:
Several typical tungsten copper alloy properties:

Grade	Tungsten content Wt%	Copper content Wt%	Density g / cm3	Thermal conductivity W / (M.K)	Thermal expansion coefficient (10-6 / K)
W90Cu10	90 & plusmn; 1	margin	17.0	180 - 190	6.5
W85Cu15	85 & plusmn; 1	margin	16.4	190 - 200	7.0
W80Cu20	80 & plusmn; 1	margin	15.6	200 - 210	8.3
W75Cu25	75 & plusmn; 1	margin	14.9	220 - 230	9.0
W50Cu50	50 & plusmn; 1	margin	12.2	310 - 340	12.5

Product use:
Microwave, laser, radio frequency, optical communications and other high-power devices, high-performance lead frame; military and civilian thermal control device thermal control board and radiator.